MeiliXin plans to adjust the private placement plan to increase investment in the semiconductor precision structural components project

Shanghai Securities News China Securities Network News: Meilixin announced a revised plan for issuing A-shares to specific targets on the evening of March 9. Based on maintaining the total fundraising amount not exceeding 1.2 billion yuan, the investment in the fundraising projects has been revised. Among them, the investment total for the “Semiconductor Equipment Precision Structural Parts Construction Project” has been increased from 551 million yuan to 742 million yuan, with the corresponding planned use of funds rising from 500 million yuan to 700 million yuan; the investment total for the “Communication and Automotive Parts Brazing and Die-casting Industrialization Project” has been decreased from 524 million yuan to 284 million yuan, with the planned use of funds reduced from 500 million yuan to 250 million yuan; the supplementary working capital has increased from 200 million yuan to 250 million yuan.

It is reported that on the evening of December 4, 2025, the company launched the above private placement plan, proposing to issue no more than 63.18 million shares to no more than 35 (including) targeted investors, raising no more than 1.2 billion yuan (including). The net proceeds after deducting issuance costs will be used for the three projects mentioned above.

According to the company, it has completed an initial layout in the semiconductor field. It has established a mature technical system in liquid cooling and heat dissipation. The technology level of brazing and die-casting integrated with heat dissipation is at the industry-leading level, enabling mass supply of products and establishing stable cooperation with leading equipment manufacturers, laying a foundation for further development of the semiconductor business. However, limited by current production capacity, the company cannot fully meet the increasing order demands of core customers, which to some extent restricts the depth and breadth of cooperation with key clients.

Meanwhile, after several years of development, the company has industry-leading technology and processes. To maintain its competitive advantage in a fierce market, it needs to continuously increase R&D investment and develop new technologies and products to meet the market’s ongoing upgrade demands for high-end semiconductor equipment components.

Through this fundraising project, the company aims to seize development opportunities in new energy vehicles, communications, and intelligent driving fields, further improve its heat dissipation product matrix, and realize a business layout of “full lifecycle thermal management solutions.” It will further expand capacity, upgrade technology, strengthen relationships with top clients, and solidify the positive cycle of “technology-order-capacity-profit,” creating higher market barriers. This will help the company enhance the development potential of its main business, achieve high-quality sustainable growth, and provide strong support for long-term future development. (Wang Yi)