Zhao Chi, San'an, and Leyard Disclose New Progress in Micro LED Optical Communication

Source: Xingjia Talk

Recently, Zhaochi Co., Sanan Optoelectronics, and Leyard have all announced progress in Micro LED optical communication.

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■ Zhaochi Co.: Micro LED light source chips are in the sample verification testing stage

On March 12, Zhaochi Co. released an announcement on the progress of its investment in the optical communication semiconductor laser chip and high-speed optical module project.

The announcement shows that Zhaochi’s high-speed optical module project has completed nearly 50,000 square meters of clean intelligent manufacturing base and is fully operational. As of this announcement, 200G and below optical modules are in mass production; the first batch of 400G/800G parallel optical transceiver modules full-process manufacturing lines have completed equipment installation and debugging, with reliability testing for 400G/800G optical modules completed and entering small-batch production, progressing orderly toward large-scale mass production; 1.6T optical modules are in rapid R&D stage, with multi-path parallel efforts on LPO, NPO, and CPO, aiming to develop the next-generation high-speed, low-power solutions.

Meanwhile, the laser chip project has also made phased progress. Previously, the company equipped a 20-cavity MOCVD (Metal-Organic Chemical Vapor Deposition) line compatible with GaAs LED and laser chips, and has now added some downstream equipment to establish a laser chip production line.

As of this announcement, 25GDFB and below rate optical chips have completed R&D and trial production, gradually transitioning to mass production; high-power series CWDFB laser chips and 50G EML laser chips used in 400G/800G/1.6T optical modules are being steadily advanced according to plan; Micro LED optical interconnect CPO (Co-packaged Optical) technology Micro LED light source chips have completed R&D and are currently in sample verification testing.

It is understood that Zhaochi’s “Annual production of 100 million optical communication semiconductor laser chips (Phase I)” and “High-speed optical modules and optical devices project (Phase I)” are planned with investments not exceeding 500 million yuan each; they will build gallium arsenide and indium phosphide semiconductor laser wafer manufacturing lines, as well as high-speed optical module and optical device manufacturing lines.

■ Sanan Optoelectronics: Micro LED light source devices have been sent to top domestic and international companies for module assembly verification

On March 11, Sanan Optoelectronics responded to investor questions on the interactive platform, stating that the company has deep collaborations with Tsinghua University, China Mobile, and other entities in the fields of Micro LED optoelectronic devices and high-speed optical communications, jointly promoting related technology R&D and application verification. The Micro LED light source devices produced by the company have excellent performance and have been sent to leading domestic and international companies for module assembly verification.

■ Leyard: Has provided Micro LED optical module products to the Chinese Academy of Sciences

On March 10, Leyard disclosed in its investor relations activity record that the company has previously collaborated with the Chinese Academy of Sciences on R&D in the optical communication field and has supplied Micro LED optical module products to CAS for replacing traditional LED optical transmission schemes. Currently, the scheme is still in R&D verification stage, with some uncertainties.

As AI drives a surge in data center computing throughput demands, Micro LED optical communication, with its advantages of low power consumption, high bandwidth, low cost, and easy integration, has become a new industry direction.

Currently, participants in Micro LED optical communication mainly include chip manufacturers and ecosystem players. Chip manufacturers are the foundation of Micro LED optical communication, responsible for providing core components such as light-emitting chips, detection chips, and driver chips, and are key to technological breakthroughs. As the “signal source” in Micro LED optical communication, the performance of light-emitting chips directly affects the bandwidth, power consumption, and stability of the optical communication link, with GaN-based chip manufacturers being the core players in this field.

Overall, Micro LED optical communication is transitioning from laboratory research to industrialization. International companies lead in ecosystem and technology, while domestic companies are rapidly catching up by leveraging their LED industry foundation. With accelerating commercialization, it may become an important solution for high-speed interconnects in the AI era.

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