Samsung, SK Hynix Reassess Hybrid Bonding Technology for Next-Generation HBM

According to Korean media, Samsung Electronics and SK Hynix are reassessing the timeline for introducing hybrid bonding technology in next-generation high-bandwidth memory (HBM). The potential delay stems from reduced demand for thickness reduction and thermal performance improvements in HBM applications. Both companies are separately developing alternative thermal solutions—HPB and iHBM—planned for integration in HBM5 products. Industry analysts note that hybrid bonding is expected to remain a critical long-term technology pathway as HBM I/O pin counts continue to increase.
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