社恐元宇宙

三星电机开始量产高通“AI200”用的FC BGA，扩大合作范围至数据中心领域
三星电机已开始量产将用于高通首款数据中心人工智能（AI）加速器的封装基板。该供应协议预计将使双方的合作从现有的移动和PC领域扩展到数据中心领域。
据韩国ZDNet 22日报道，三星电机最近在釜山工厂开始大规模生产用于高通最新AI加速器“AI200”的倒装芯片球栅阵列（FC BGA）。
AI200是高通于去年十月推出的首款数据中心AI加速器，专为AI推理工作负载设计。它配备了高通自主研发的“Oryon” CPU和“Hexagon” NPU，搭配LPDDR5，这是一种具有强大能效的低功耗DRAM。
高通计划在今年下半年推出AI200，三星电机似乎已按照这一时间表开始其FC BGA的量产。
由于三星电机为高通AI200大规模生产的FC BGA属于初始产量，报道指出目前产量尚属有限。即便如此，此举被视为具有重要意义，因为三星电机与高通的合作正从移动和PC领域扩展到数据中心半导体领域。此前，三星电机一直为高通的IT设备应用处理器（AP）提供封装基板。
一位半导体行业官员表示：“由于三星电机与高通合作已久，AI加速器FC BGA的供应协议似乎顺利达成，”他补充说：“高通计划今年推出AI200，明年推出AI250，三星电机也能因此受益，客户基础得以多元化。”
据悉，LG Innotek也在

如果事情真的按这样发展……哈哈，那将会非常棒。
Jefferies 进行了与一位记忆顾问的专家电话会议，据这位专家称，记忆价格预计在2026年第三季度环比上涨40–50%，随后在2026年第四季度再环比上涨30–40%。
这明显高于目前市场普遍预期的2026年第三季度15–20%以及2026年第四季度低于30%的涨幅。

TSMC CoPoS Pilot Line Demo Equipment Suppliers
Lithography and Coating: Canon's FPA-5525iV LF2 lithography tool; Germany's SUSS DSC310s Gen4 exposure system and ACS310 Gen2 coating/developing platform; Japan's TEL LITHIUS Pro SQ3; SCREEN's LM-3000; and Scientech's panel level release layer coating equipment.
Metallization and Copper Plating: Applied Materials (應材), KLA-Tencor (科磊), and 力鼎精密. Copper plating is handled by Lam Research's SABRE 3D FP, while UBM etching includes Lam Research's Quaros FP.
Grinding and Laser Processing: Japan's DISCO has secured nearly all of the related equipment or

Samsung Electronics Breaks Ground in Earnest on Its Last Pyeongtaek Semiconductor Fab
Samsung Electronics has begun preparations to break ground on "P5 Fab 2," the final fab at its Pyeongtaek campus in Gyeonggi Province. As a wave of artificial intelligence (AI) infrastructure investment has driven a surge in memory chip orders, the company has moved up the timing of its capital investment by roughly six months from the original plan.
Construction Equipment Deployed at the P5 Fab 2 Site
According to the industry on the 21st, several pile drivers have recently been newly positioned at Samsung E

Korean media reported that CXMT employees who received equity incentives ahead of the company’s listing could end up holding shares worth hundreds of thousands of dollars per person.
This is because CXMT granted large-scale equity awards in 2021 and 2023 to around 7,000 core employees, including engineers. CXMT founder and chairman Zhu Yiming also plans to distribute 50% of the shares he will receive as a listing-related performance bonus to employees, which is estimated to amount to around RMB 1 million, or $150,000, per employee.
Among the executives set to receive significant rewards are Ch

What do you think about Micron’s earnings? I read Citi’s preview report, and their ASP assumptions looked way too conservative. If consensus is around that level, I’m starting to think Micron could potentially deliver an upside surprise this quarter.
$MU

Korea’s June semiconductor export unit prices
(Historical figures are based on full-month data, while June 2026 figures are based on June 1–20 preliminary data)
- DRAM (excluding modules) export unit price: $82,260/kg, up 576% Y/Y and up 6% M/M
- DRAM (including modules) export unit price: $58,740/kg, up 491% Y/Y and down 4% M/M
- Flash memory export unit price: $72,784/kg, up 546% Y/Y and up 28% M/M
- MCP (HBM) export unit price: $95,939/kg, up 119% Y/Y and up 15% M/M

South Korea Preliminary Exports (June 1–20)
- DRAM (including modules): +342% YoY, +3% MoM
- Flash Memory (NAND): +336% YoY, +28% MoM
- SSD: +405% YoY, +25% MoM
- MCP (HBM): +209% YoY, +51% MoM

South Korea Preliminary Exports (June 1–20)
- DRAM (including modules): +342% YoY, +3% MoM
- Flash Memory (NAND): +336% YoY, +28% MoM
- MCP (HBM): +209% YoY, +51% MoM
- SSD: +405% YoY, +25% MoM

JEDEC Ratifies 'SPHBM4' Standard; Glass Substrate Utility Draws Attention
The Joint Electron Device Engineering Council (JEDEC) has ratified a new standard that broadens the addressable scope of high bandwidth memory (HBM). Industry observers suggest that, alongside a shift in the cost structure of artificial intelligence (AI) chips, the value of glass substrate adoption could come into sharper focus.
According to JEDEC on the 21st, the new HBM4 standard, "SPHBM4 (Standard Package HBM4)," received final board approval following deliberations within the DRAM memory subcommittee (JC-42.2).
SPHBM

There have been reports since February that HP, Dell, and others have been evaluating Chinese memory, but it seems like they still haven’t made a decision.
(The following is from today’s Wall Street Journal article.)

More and more sell-side firms are saying that higher memory prices are becoming an inflationary headwind.

The basket has delivered a pretty solid return so far.
Considering the starting date was April 27, I think the performance has been quite respectable.
You can view the basket here:

Taiwan Makers Poised to Raise Chip Resistor Prices as China Players Hike and the Price Gap Narrows
As Taiwanese chip resistor makers shift to selective order taking and cull orders that carry no profit, low price chip resistor orders are flowing to Chinese chip resistor makers. Ralec (厚聲), the world's second largest chip resistor maker, and Guangdong Fenghua (風華高科), China's leading passive components player, have successively notified distributors of chip resistor price increases. Because a certain price gap exists between Taiwanese and Chinese chip resistors, the convergence of that gap leave