Tower Semiconductor Invests $3 Billion in Japan Chip Manufacturing on July 14

According to Reuters, Tower Semiconductor announced on July 14 plans to invest $3 billion in Japan's semiconductor manufacturing operations, including $1 billion in government funding. The first phase will significantly expand 300-millimeter silicon photonics production capacity at its Fab 6 facility, with full production expected in Q4 2027. A second phase, to be launched simultaneously, will establish a new 300-millimeter photolithography equipment manufacturing plant adjacent to Fab 7.
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